The multilayer materials in aerospace applications generally subject to thermal shock, which
may significantly affect the interfacial thermal resistance (ITR) and cause serious …

The necessities of lead-free solder alloys have been expanded by the advent of eco-friendly
technologies of microelectronic packaging industry. Mostly lead-free solder alloys are SAC …

With the advent of environment friendly microelectronic packaging technologies, the
demand of lead-free solders alloy has escalated. Leadfree solder material is an alloy of Tin …

MXenes have rapidly gained prominence since their serendipitous discovery in 2011 in the
field of 2D materials due to their exceptional properties, which leads to strong applications in …

The implementation of environment friendly technologies in microelectronic packaging
industry has widened the essentialities of lead-free solder alloys. The Cu 3 Sn intermetallic …

Graphite film (GF) is considered as an unrivaled candidate of heat sink in thermal
management applications. The inappropriate thermal interface material (TIM), however …

Uncertainty quantification plays a pivotal role in advancing the development of reliable and
high-performance material designs via multiscale materials modeling. This study focuses on …

The effects of a void and temperature on the fracture of Cu/Cu 3 Sn bilayers (as solder joints
in electronic packages) under a tensile test are studied using molecular dynamics …