Composite materials for printed electronics in Internet of Things applications
K Janeczek - Bulletin of Materials Science, 2020 - Springer
Printed electronics belongs to one of the most prominent electronics technologies allowing
us to manufacture electronic components and devices on different kinds of substrate …
us to manufacture electronic components and devices on different kinds of substrate …
[HTML][HTML] Jetting dynamics of Newtonian and non-Newtonian fluids via laser-induced forward transfer: Experimental and simulation studies
Current technological trends in the field of microelectronics have highlighted the
requirement to use cost-effective techniques for the precise deposition of highly resolved …
requirement to use cost-effective techniques for the precise deposition of highly resolved …
Laser-induced forward transfer (LIFT) technique as an alternative for assembly and packaging of electronic components
F Zacharatos, M Makrygianni… - IEEE Journal of Selected …, 2021 - ieeexplore.ieee.org
Current trends in microelectronics chip bonding and assembly encompass ultra-fine pitch
components with flexible form factors and advanced die-attach materials, which can sustain …
components with flexible form factors and advanced die-attach materials, which can sustain …
Eco-friendly lead-free solder paste printing via laser-induced forward transfer for the assembly of ultra-fine pitch electronic components
M Makrygianni, F Zacharatos, K Andritsos… - Materials, 2021 - mdpi.com
Current challenges in printed circuit board (PCB) assembly require high-resolution
deposition of ultra-fine pitch components (< 0.3 mm and< 60 μm respectively), high …
deposition of ultra-fine pitch components (< 0.3 mm and< 60 μm respectively), high …
One-step additive LIFT printing of conductive elements
A Nastulyavichus, S Kudryashov… - Laser Physics …, 2024 - iopscience.iop.org
The feasibility of printing silver and copper conductive elements on a glass substrate in a
one-step through the laser-induced forward transfer method has been successfully …
one-step through the laser-induced forward transfer method has been successfully …
Laser induced forward transfer of solder paste for microelectronics assembly applications
M Makrygianni, I Theodorakos… - Laser Applications …, 2021 - spiedigitallibrary.org
Currently the most widely used technique for solder paste deposition is Surface Mount
Technology (SMT), which involves the printing of solder paste using a stencil, onto printed …
Technology (SMT), which involves the printing of solder paste using a stencil, onto printed …
Fabrication of thin films as a drug delivery tool via laser-induced forward transfer
C Kryou, IM Orfanou, A Kalaitzis… - Laser-based Micro …, 2021 - spiedigitallibrary.org
The use of different 3D printing technologies for pharmaceutical manufacturing provides
new opportunities for personalized medicine and on-demand tailored drug products. In this …
new opportunities for personalized medicine and on-demand tailored drug products. In this …
Research status on flexible electronic skin based on laser reduction graphene oxide
Z Zhou, Q Zhai - 2nd International Conference on Laser, Optics …, 2022 - spiedigitallibrary.org
Graphene materials prepared by traditional process have the disadvantages of grain
boundary defects and uncontrollable parameters, which limit the application of graphene …
boundary defects and uncontrollable parameters, which limit the application of graphene …