The evolution of electronic packaging technology towards the adoption of glass substrates
marks a significant advancement in overcoming the constraints posed by traditional organic …

This article proposes a computational fluid dynamics (CFD)-based machine learning (ML)
model to set the temperature of a convection reflow oven and control conveyor speed. Due …

The escalating demand for high-performance computing is driving the expansion of high-
end packages, leading to increased power requirements. Efficient heat dissipation is crucial …

The growth in 5G, AI, HPC and IoT have been in the rise in the past few years. This
exponential growth has led to research and development of co-packaged optics (CPO) …

As electronic packages continue to get smaller, designing reliable solder joints is becoming
an increasingly important part of the design process. The shape and height of the solder …

A reliable constitutive model for copper is important for simulating the thermomechanical
behavior of copper through glass via (TGV) in the glass interposer. This study presents a …

Better understanding and control of residual stress in the chip build-up layer are becoming
more and more important for the assembly process. To estimate the chip warpage and …

The rapid advancement of artificial intelligence (AI) has propelled the demand for high-
performance computing (HPC) systems capable of handling vast amounts of data. This …

Reflow soldering is a technique that temporarily applies solder paste to contact pads of
numerous surface mount components Reflow profiling is an optimization process to …

This study introduces a novel method for expeditiously configuring the heating zone
temperatures and conveyor speed of a reflow oven, particularly for thick PCBs with bulky …