The effect of grain size on the high-strain, high-strain-rate behavior of copper
MA Meyers, UR Andrade, AH Chokshi - Metallurgical and materials …, 1995 - Springer
Copper with four widely differing grain sizes was subjected to high-strain-rate plastic
deformation in a special experimental arrangement in which high shear strains of …
deformation in a special experimental arrangement in which high shear strains of …
Thermal stability of sputtered Cu films with nanoscale growth twins
We have investigated the thermal stability of sputter-deposited Cu thin films with a high
density of nanoscale growth twins by using high-vacuum annealing up to 800 C for 1 h …
density of nanoscale growth twins by using high-vacuum annealing up to 800 C for 1 h …
Grain growth and strain release in nanocrystalline copper
L Lu, NR Tao, LB Wang, BZ Ding, K Lu - Journal of Applied Physics, 2001 - pubs.aip.org
Grain growth and strain release processes in the electrodeposited nanocrystalline (nc) Cu
specimen with a high purity were investigated by means of differential scanning calorimetry …
specimen with a high purity were investigated by means of differential scanning calorimetry …
In situ TEM study of grain growth in nanocrystalline copper thin films
Nanocrystalline metals demonstrate a range of fascinating properties, including high levels
of mechanical strength. However, as these materials are exposed to high temperatures, it is …
of mechanical strength. However, as these materials are exposed to high temperatures, it is …
An integrated full-field model of concurrent plastic deformation and microstructure evolution: Application to 3D simulation of dynamic recrystallization in polycrystalline …
Many time-dependent deformation processes at elevated temperatures produce significant
concurrent microstructure changes that can alter the mechanical properties in a profound …
concurrent microstructure changes that can alter the mechanical properties in a profound …
Heterogeneous microstructural evolution during hydrodynamic penetration of a high-velocity copper microparticle impacting copper
Microparticle hydrodynamic penetration (HDP) may be associated with the erosion regime in
cold spray processing and other high-velocity impact events. Here, in an experimental …
cold spray processing and other high-velocity impact events. Here, in an experimental …
A unified static and dynamic recrystallization Internal State Variable (ISV) constitutive model coupled with grain size evolution for metals and mineral aggregates
A history dependent and physically-motivated Internal State Variable (ISV) constitutive
model is presented that simultaneously accounts for the effects of static recrystallization …
model is presented that simultaneously accounts for the effects of static recrystallization …
Impurity effect on recrystallization and grain growth in severe plastically deformed copper
Y Jiang, RC Gu, M Peterlechner, YW Liu… - Materials Science and …, 2021 - Elsevier
The impurity effect on commercial purity copper (4 N and 3 N) was investigated by
comparing their annealing induced recrystallization and grain growth behavior after severe …
comparing their annealing induced recrystallization and grain growth behavior after severe …
Die-Attach bonding with etched micro brass metal pigment flakes for high-power electronics packaging
Sinter pastes for rapid and low-temperature die-attach bonding are developed to enable
sintering under a nitrogen atmosphere. First, microscale brass metal pigment flakes are …
sintering under a nitrogen atmosphere. First, microscale brass metal pigment flakes are …
Abnormal grain growth in alumina dispersion-strengthened copper produced by an internal oxidation process
Cu–2.7 vol.% Al2O3 (15nm) composite was synthesized by an internal oxidation and hot
extrusion process. The grain growth at elevated temperatures was studied and compared …
extrusion process. The grain growth at elevated temperatures was studied and compared …