Decomposable and template polymers: Fundamentals and applications

E Uzunlar, J Schwartz… - Journal of …, 2016 - asmedigitalcollection.asme.org
Polymers can be used as temporary place holders in the fabrication of embedded air gaps in
a variety of electronic devices. Embedded air cavities can provide the lowest dielectric …

An energy-efficient nonvolatile in-memory computing architecture for extreme learning machine by domain-wall nanowire devices

Y Wang, H Yu, L Ni, GB Huang, M Yan… - IEEE Transactions …, 2015 - ieeexplore.ieee.org
The data-oriented applications have introduced increased demands on memory capacity
and bandwidth, which raises the need to rethink the architecture of the current computing …

An energy-efficient matrix multiplication accelerator by distributed in-memory computing on binary RRAM crossbar

L Ni, Y Wang, H Yu, W Yang, C Weng… - 2016 21st Asia and …, 2016 - ieeexplore.ieee.org
Emerging resistive random-access memory (RRAM) can provide non-volatile memory
storage but also intrinsic logic for matrix-vector multiplication, which is ideal for low-power …

Distributed in-memory computing on binary RRAM crossbar

L Ni, H Huang, Z Liu, RV Joshi, H Yu - ACM Journal on Emerging …, 2017 - dl.acm.org
The recently emerging resistive random-access memory (RRAM) can provide nonvolatile
memory storage but also intrinsic computing for matrix-vector multiplication, which is ideal …

A simple BSP-based model to predict execution time in GPU applications

M Amaris, D Cordeiro, A Goldman… - 2015 IEEE 22nd …, 2015 - ieeexplore.ieee.org
Models are useful to represent abstractions of software and hardware processes. The Bulk
Synchronous Parallel (BSP) is a bridging model for parallel computation that allows …

Analytical modeling and performance benchmarking of on-chip interconnects with rough surfaces

S Kumar, R Sharma - IEEE Transactions on Multi-Scale …, 2017 - ieeexplore.ieee.org
In planar on-chip copper interconnects, conductor losses due to surface roughness
demands explicit consideration for accurate modeling of their performance metrics. This is …

A silicon interposer platform utilizing microfluidic cooling for high-performance computing systems

L Zheng, Y Zhang, MS Bakir - IEEE Transactions on …, 2015 - ieeexplore.ieee.org
In this paper, a silicon interposer platform using microfluidic cooling is proposed for high-
performance computing systems. The key advantage of the the silicon interposer is its very …

Effect of Resistance variability in Vector Matrix Multiplication operations of 1T1R ReRAM crossbar arrays using an Embedded test platform

J Solanki, K Beckmann, J Pelton… - 2023 IEEE 32nd …, 2023 - ieeexplore.ieee.org
Vector math operations are considered one of the basic operations for computationally
intensive algorithms. The latest emerging resistive random access memory device (ReRAMI) …

A planar wideband balanced crossover

YH Pang, JJ Li - IEEE Transactions on Components, Packaging …, 2018 - ieeexplore.ieee.org
A planar wideband balanced crossover is presented in this paper. It consists of four
balanced ports and two connected microstrip rings. Owing to its bisymmetry, even-odd mode …

Chip-to-chip copper interconnects with rough surfaces: analytical models for parameter extraction and performance evaluation

S Kumar, R Sharma - IEEE Transactions on Components …, 2017 - ieeexplore.ieee.org
In multigigahertz integrated circuit design, the extra delay and power losses due to surface
roughness in copper (Cu) interconnects is more evident than ever before and needs utmost …