Laser‐Based Micro/Nano‐Processing Techniques for Microscale LEDs and Full‐Color Displays

Y Gong, Z Gong - Advanced Materials Technologies, 2023 - Wiley Online Library
Micro light‐emitting diode (Micro‐LED) display is an emerging display technology thanks to
its high brightness, fast switching speed, and low power consumption. The …

Epitaxial growth of group III-nitride films by pulsed laser deposition and their use in the development of LED devices

G Li, W Wang, W Yang, H Wang - Surface Science Reports, 2015 - Elsevier
Recently, pulsed laser deposition (PLD) technology makes viable the epitaxial growth of
group III-nitrides on thermally active substrates at low temperature. The precursors …

Enhancement of (In, Ga) N light-emitting diode performance by laser liftoff and transfer from sapphire to silicon

ZS Luo, Y Cho, V Loryuenyong, T Sands… - IEEE Photonics …, 2002 - ieeexplore.ieee.org
(In, Ga) N light-emitting diodes (LEDs) fabricated on a sapphire growth substrate were
successfully integrated onto Si substrates by a double-transfer technique using excimer …

Method of fabricating vertical structure LEDs

JL Lee, I Jeong, M cheol Yoo - US Patent 7,928,465, 2011 - Google Patents
A method of fabricating semiconductor devices, such as GaN LEDs, on insulating substrates,
such as sapphire. Semiconductor layers are produced on the insulating substrate using …

Use of patterned laser liftoff process and electroplating nickel layer for the fabrication of vertical-structured GaN-based light-emitting diodes

SJ Wang, KM Uang, SL Chen, YC Yang… - Applied Physics …, 2005 - pubs.aip.org
The fabrication process and performance characteristics of a vertical-structured GaN-based
light-emitting diode (VM-LED) employing nickel electroplating and patterned laser liftoff …

Transfer of GaN LEDs from sapphire to flexible substrates by laser lift-off and contact printing

J Chun, Y Hwang, YS Choi, T Jeong… - IEEE Photonics …, 2012 - ieeexplore.ieee.org
We fabricate flexible GaN-based light-emitting diode (LED) systems by laser lift-off (LLO)
and transfer printing methods. LLO enables transferring a whole GaN LED layer from …

Method of fabricating vertical devices using a metal support film

M cheol Yoo - US Patent 8,294,172, 2012 - Google Patents
A method of fabricating semiconductor devices, such as GaN LEDs, on insulating substrates,
such as sapphire. Semiconductor layers are produced on the insulating substrate using …

Vertically stacked color tunable light-emitting diodes fabricated using wafer bonding and transfer printing

J Chun, KJ Lee, YC Leem, WM Kang… - … Applied Materials & …, 2014 - ACS Publications
We report on the vertically stacked color tunable light-emitting diodes (LEDs) fabricated
using wafer bonding with an indium tin oxide (ITO) layer and transfer printing by the laser lift …

Performance enhancement of InGaN light-emitting diodes by laser lift-off and transfer from sapphire to copper substrate

BS Tan, S Yuan, XJ Kang - Applied Physics Letters, 2004 - pubs.aip.org
Laser lift-off technique was employed to carry out transfer of prefabricated InGaN multiple-
quantum-well light-emitting diodes (LEDs) from sapphire onto Cu substrate. Silver epoxy …

Method of fabricating vertical structure LEDs

JL Lee, I Jeong, M cheol Yoo - US Patent 7,250,638, 2007 - Google Patents
A method of fabricating semiconductor devices, such as GaN LEDs, on insulating substrates,
such as sapphire. Semiconductor layers are produced on the insulating substrate using …