Automatic wire bonding is a highly mature, cost-efficient and broadly available back-end
process, intended to create electrical interconnections in semiconductor chip packaging …

We introduce a novel, low-cost and high-performance hot-wire air flow sensor which utilizes
a bond-wire as the sensing element. Standard wire-bonding methods are used to form the …

Here we introduce a novel micro-hydraulic structure that can significantly improve
performance of many MEMS devices. Using this structure we fabricate and test a new type of …

Small autonomous aerial systems require the ability to detect roll, pitch, and yaw to enable
stable flight. Existing inertial measurement units (IMUs) are incapable of accurately …

Nature and biology utilize a myriad of structures, materials, and schemes to achieve superb
sensing performance with extreme reliability and robustness. One structure used more …

A novel, optimally-designed micro-hydraulic structure is introduced to significantly improve
performance of many MEMS devices for sensing and actuation. The micro-hydraulic system …