Semiconductor device with hollow interconnectors
C Yi-Hsien - US Patent 11,876,074, 2024 - Google Patents
The present application discloses a semiconductor device. The semiconductor device
includes a package structure including a first side and a second side opposite to the first …
includes a package structure including a first side and a second side opposite to the first …
Semiconductor package
KIM Gayoung, H Jang - US Patent App. 18/236,545, 2023 - Google Patents
H01L23/522—Arrangements for conducting electric current within the device in operation
from one component to another, ie interconnections, eg wires, lead frames including …
from one component to another, ie interconnections, eg wires, lead frames including …
Package structure with buffer layer embedded in lid layer
Provided is a package structure including a substrate, a stiffener ring, an eccentric die, a lid
layer, and a buffer layer. The stiffener ring is disposed on the substrate. The stiffener ring has …
layer, and a buffer layer. The stiffener ring is disposed on the substrate. The stiffener ring has …
Semiconductor package
CY Yu, J Cheng, Y Liang, JY Wu, YF Su… - US Patent …, 2023 - Google Patents
A semiconductor package includes a substrate, a semiconductor device, and a ring
structure. The semiconductor device disposed on the substrate. The ring structure disposed …
structure. The semiconductor device disposed on the substrate. The ring structure disposed …