Modeling of material removal in copper blanket wafer polishing based on the hard polishing pad microstructure
In the manufacture of integrated circuits (ICs), copper is used primarily as the multilevel
interconnect material, which is manufactured with a dual damascene technique utilizing …
interconnect material, which is manufactured with a dual damascene technique utilizing …
Chemical mechanical polishing for indium bond pad damascene processing
K Ceulemans, E Shafahian, H Struyf… - Japanese Journal of …, 2024 - iopscience.iop.org
We investigated chemical mechanical polishing (CMP) of indium, with the goal of obtaining
indium bond pads for later cryo-3D integration of quantum computing-related chips, through …
indium bond pads for later cryo-3D integration of quantum computing-related chips, through …
Automated Vickers hardness system with closed-loop control for polishing pads for semiconductor production
Chemical mechanical polishing plays a pivotal role in enhancing the topography of wafers
during semiconductor fabrication. The hardness of polishing pads holds great significance …
during semiconductor fabrication. The hardness of polishing pads holds great significance …
Microscopic fractures shown inside tablets after impact
In prior work, rough handling of oral tablets had been observed to drastically speed up their
disintegration in water. The purpose of this study was to confirm or refute that the formation …
disintegration in water. The purpose of this study was to confirm or refute that the formation …