More and more studies are today focusing on solar systems owing to the increasing
awareness about global warming caused by conventional energy technologies and techno …

As to promote the performance of the solder joints applied to electronics industry, the
researchers take advantage of micro/nano-sized particles or another element coated on …

Lead-free solder research has witnessed a great jump in the past decades due to the
increased restrictions over the use of toxic lead-bearing solder alloys. Among the …

The properties of Sn99Ag0. 3Cu0. 7 (SACX0307) solder alloy reinforced with ZnO
nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm …

The effect of SiC nano-phases (nano-particles and nano-fibers) addition into SAC0307
solder paste was investigated on the thermal and microstructural properties of the composite …

With the development of microelectronic packaging and increasingly specific service
environment of solder joints, much stricter requirements have been placed on the properties …

The influence of the joint size on the growth of intermetallic compound (IMC) between Sn-3.0
Ag-0.5 Cu-0.1 TiO 2 composite solder and Cu pad during isothermal aging at temperatures …

The main joining process of the electronic industry is still soldering with different alloys of Sn.
This work studied the relationship between Sn whisker growth and corrosion resistance of …

This work investigates the impact of Bi content on the microstructure of solder joints under
various thermal cycling conditions. Five lead-free solder alloys were used to assemble test …

The effects of adding CeO 2 nanoparticles on the formation and growth of interfacial
intermetallic compounds (IMCs) between Sn-0.3 Ag-0.7 Cu-xCeO 2 (x= 0, 0.05, 0.1, 0.15 …