Gapless Chip‐in‐Carrier Integration and Injectable Ag/AgCl‐Epoxy Reference Electrode for Bilayer Lipid Membrane Sensor

H Wakebe, Y Susumago, T Fukushima… - IEEJ Transactions on …, 2023 - Wiley Online Library
There are emerging needs for bilayer lipid membrane (BLM) sensors utilizing the vastly and
highly developed molecular recognition ability of membrane proteins, especially those …

Comparison of conventional and maskless lithographic techniques for more than Moore post-processing of foundry CMOS chips

A Tsiamis, Y Li, C Dunare, JRK Marland… - Journal of …, 2020 - ieeexplore.ieee.org
This article details and compares the technology options for post-processing foundry
produced CMOS at chip-scale to enable More than Moore functionality. In many cases there …

Die-level integration of metal MEMS with CMOS

AG Mukherjee, ME Kiziroglou… - 2008 2nd Electronics …, 2008 - ieeexplore.ieee.org
The integration of CMOS electronics with MEMS (micro-electro-mechanical systems) is
attractive because it allows MEMS components to be co-located with their associated control …

A novel technique for die-level post-processing of released optical MEMS

MY Elsayed, PO Beaulieu, J Briere… - Journal of …, 2016 - iopscience.iop.org
This work presents a novel die-level post-processing technique for dies including released
movable structures. The procedure was applied to microelectromechanical systems (MEMS) …

Electrodeposition of Au for self-assembling 3D microstructures

ME Kiziroglou, AG Mukherjee… - Micromachining …, 2008 - spiedigitallibrary.org
Rotation of structures fabricated by planar processing into out-of-plane orientations can be
used to greatly increase the 3-dimensionality of microstructures. Previously this has been …

Integration of self-assembled inductors with CMOS LC oscillators

AG Mukherjee, S Vatti, ME Kiziroglou… - 2009 European …, 2009 - ieeexplore.ieee.org
The quality factor (Q) of integrated inductors is of great importance to radio frequency
applications. Monolithic integration of out-of-plane Au inductors with Complementary Metal …

[PDF][PDF] Fabrication of RF MEMS components on CMOS circuits

AG Mukherjee, ME Kiziroglou, S Vatti… - Proc. of …, 2008 - researchgate.net
Recently deep submicron and SiGe (silicongermanium) bipolar CMOS technologies have
enhanced the performance of Si-based radio frequency (RF) integrated circuits up to …

[PDF][PDF] Northumbria Research Link

D Smith, JG Terry, S Mitra, I Underwood, A Murray… - core.ac.uk
This paper details and compares the technology options for post–processing foundry
produced CMOS at chipscale to enable More than Moore functionality. In many cases there …