In a multi-chip module (MCM), a “super chip (110N) is attached to multiple “plain” chips
(110F:“super” and “plain chips can be any chips). The Super chip is positioned above the …

(57) ABSTRACT A semiconductor package structure including a first semi conductor
package is provided. The first semiconductor package includes a first redistribution layer …

HOIL 2/56(2006.01)(57) ABSTRACT HOIL 23/3(2006.01) A method for assembling a 3D
integrated circuit package that HOIL 25/00(2006.01) includes a base device and a top …

The disclosed embodiments relate to an optoelectronic module, comprising one or more
optical chips, and a molded substrate, which is molded around the one or more optical …

An embodiment is a method including forming a first passive device in a first wafer, forming a
first dielectric layer over a first side of the first wafer, forming a first plurality of bond pads in …

ABSTRACT A multi-stacked package-on-package structure includes a method. The method
includes: adhering a first die and a plurality of second dies to a substrate, the first die having …

An embodiment is a method including forming a first passive device in a first wafer, forming a
first dielectric layer over a first side of the first wafer, forming a first plurality of bond pads in …

Provided is a stack module package including: a first Substrate where a first device is
mounted, and a second substrate where a second device is mounted. The second Substrate …

[0002] Packaged semiconductor devices are often found in a large spectrum of electronic
products—from sewing machines to washing machines, from automobiles to cellular …

A manufacturing method of a package structure includes at least the following steps. At least
one first die is disposed over a carrier. The first die is encapsulated using a first encapsulant …