This paper provides an overview of technical enhancements of current encapsulant
materials (epoxy molding compound and underfill) and future deployment of graphene …

Advanced packaging technology, also known as system scaling, bridges the gap between
chip and package sizes by mounting multiple chips on a single package substrate. 2.5-D …

In the post-Moore era, advanced electronic packaging technology emerges as a prominent
direction for the future evolution of semiconductor industry. Nevertheless, warpage remains …

Currently, in the manufacturing industry, there are many different component manufacturing
processes. Each of them has its own advantages and disadvantages. One phenomenon …

Despite the fact that temperature is an important condition that affects the behavior of
material interfaces used in integrated circuits (ICs), such as the case for epoxy molding …

Recently, applying a machine learning to surrogate modeling for rapid optimization of
complex designs have been widely researched. Once trained, the machine learning …