Advances in electrolytic copper foils: fabrication, microstructure, and mechanical properties

LL Lu, HT Liu, ZD Wang, QQ Lu, YJ Zhou, F Zhou… - Rare Metals, 2024 - Springer
Electrolytic copper foil has gained significant attention as an essential component in lithium-
ion batteries (LIBs), printed circuit boards (PCBs), and chip packaging substrates (CPSs) …

The time-varying effect of thiourea on the copper electroplating process with industrial copper concentrations

T Collet, B Wouters, N Hallemans, K Ramharter… - Electrochimica …, 2023 - Elsevier
Electrorefining is the process of choice to purify several metals, among which is copper. A
crucial process parameter in electrorefining, and electroplating in general, is the additive …

A novel strategy to electrodeposit high-quality copper foils using composite additive and pulse superimposed on direct current

W Yu, C Lin, Q Li, J Zhang, P Yang, M An - Journal of Applied …, 2021 - Springer
As a crucial material for fabrication of lithium-ion battery current collector, the properties of
electrodeposited copper foil are closely related to the battery performances. How to improve …

Adsorption of gelatin during electrodeposition of copper and tin–copper alloys from acid sulfate electrolyte

C Meudre, L Ricq, JY Hihn, V Moutarlier… - Surface and Coatings …, 2014 - Elsevier
Abstract An acid Cu–Sn deposition bath was developed, and copper and copper–tin
coatings were electrodeposited on polycrystalline platinum. The effect of gelatin on copper …

Controllable fabrication of CuS hierarchical nanostructures and their optical, photocatalytic, and wave absorption properties

S He, GS Wang, C Lu, X Luo, B Wen, L Guo… - …, 2013 - Wiley Online Library
A series of CuS nanostructures were synthesized by a simple wet chemical method on a
large scale in the presence of cetyltrimethylammonium bromide at low temperature. Three …

An operando ORP-EIS study of the copper reduction reaction supported by thiourea and chlorides as electrorefining additives

T Collet, N Hallemans, B Wouters, K Ramharter… - Electrochimica …, 2021 - Elsevier
Additives are used in metal electroreduction processes to obtain a smooth and optimal metal
deposit. However, the mechanism with which these additives influence the metal deposition …

Effects of brighteners in a copper plating bath on throwing power and thermal reliability of plated through holes

TC Chen, YL Tsai, CF Hsu, WP Dow, Y Hashimoto - Electrochimica Acta, 2016 - Elsevier
Plating through holes (PTH) of a printed circuit board (PCB) by copper electroplating were
performed using 3-mercapo-1-1-propanesulfonate (MPS), 3-S-thiuronium propanesulfonate …

Optimisation of thiourea concentration in a decorative copper plating acid bath based on methanesulfonic electrolyte

L Fabbri, W Giurlani, G Mencherini, A De Luca… - Coatings, 2022 - mdpi.com
The role of thiourea as an organic additive in the nucleation and growth mechanism was
studied for copper deposition and its application in the decorative electroplating and fashion …

Electrodeposition and characterization of copper sulfide (CuS) thin film: towards an understanding of the growth mechanism

A Ait-karra, O Zakir, A Ait baha, M Lasri… - Journal of Solid State …, 2023 - Springer
Copper sulfide (CuS) thin film was electrodeposited onto stainless steel (SS 316L) substrate
under pulse potential control, from an aqueous acidic solution containing 10− 3 M of CuSO4 …

Effect of organic additives on synthesis of copper nano powders by pulsing electrolysis

RK Nekouie, F Rashchi, NN Joda - Powder Technology, 2013 - Elsevier
Pulsing electrolysis is a method to produce high purity nano copper powder. Effect of 5
organic additives, polyvinylpyrrolidone (PVP), sodium dodecyl sulfate (SDS), polyethylene …