This book describes the equipment used in manufacturing for deposition and etching, such
as electrochemical deposition equipment used for plating copper. It emphasizes the …

The concept of high entropy alloys (HEAs) or multi-principal component alloys has inspired
a great progress of physical metallurgy along with several unusual phenomena. The high …

In this work, we have designed copper chemical mechanical planarization (CMP)
experiments to investigate the effect of slurry components on the planarization performance …

Wafer bonding technology is one of the key technologies for high-density three-dimensional
integration. We demonstrated 300 mm wafer-level hybrid bonding with Cu and an interlayer …

Chemical mechanical planarization (CMP) is a vital process for the fabrication of advanced
copper multilevel interconnects schemes. The formidable challenge in barrier CMP is that …

It becomes very critical for yield enhancement to accomplish defect free global planarization
during barrier CMP. Conventional commercial barrier chemical mechanical polishing (CMP) …

Typical metal corrosions caused by the chemical mechanical planarization (CMP) process
are discussed in this review paper. By categorizing them into seven kinds of corrosion …

This paper examines whether electrolysis could be a useful method in the development of
latent fingerprints on fired brass cartridge cases. The influence of electrolysis on galvanic …

In this study, multi-step chemical mechanical polishing (CMP) with different copper removal
rates and polishing pads is used to eliminate topography efficiently and to reduce micro …

Chemical mechanical planarization (CMP) is widely used in the fabrication of semiconductor
devices to achieve global planarization. The overall CMP performance is affected by …