The decoupling of modern printed circuit boards introduces a very complex task. Powerful
stochastic optimizers are usually used to determine values and positions of decoupling …

The board-level power network design process is governed by system-level parameters,
such as the number of layers and the ball grid array (BGA) pattern. These parameters …

Advances in semiconductor fabrication technology have produced explosive growth in the
number of transistors within an integrated circuit (IC). Modern devices consist of dozens of …

In this article a circuit level analytic approach is proposed for radiated susceptibility analysis
of a system power distribution network (PDN). For this purpose, electromagnetic wave …

A modeling methodology to calculate the decoupling capacitor interconnect inductance in a
multi-layer PCB is proposed herein. The methodology is based on the resonant cavity model …

Multilayer ceramic capacitors are characterized using one-port network analyzer
measurements. The proposal allows determining the bias-dependent capacitance and the …

Acoustic noise induced by multilayer ceramic capacitors (MLCCs) in power distribution
network (PDN) is a critical issue regarding product user experience. In this work, design …

To reduce the noise created by a power delivery network, the number, the value of
decoupling capacitors and their arrangement on the board are critical to reaching this goal …

Power Distribution Network (PDN) design is an important part of high-speed digital designs.
In order to meet the need of high operation speed and low power voltage supply, the …

The simultaneous connection and disconnection of multiple transistors in the chip can cause
voltage fluctuations in the power distribution network (PDN), known as simultaneous …