Electromigration effects in power grids characterized from a 65 nm test chip

C Zhou, R Fung, SJ Wen, R Wong… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
A 65 mn test chip to study electromigration (EM) events in integrated circuit power grids was
taped-out and successfully tested. A 9× 9 grid was implemented using M3 and M4 metal …

Highly efficient implementation of physical unclonable functions on FPGAs

S Gehrer - 2017 - mediatum.ub.tum.de
Physical Unclonable Functions (PUFs) are an innovative way to use physical uniqueness of
a device for the generation of intrinsic cryptographic keys. This work presents a new method …

Combined modeling of electromigration, thermal and stress migration in AC interconnect lines

S Rothe, J Lienig - Proceedings of the 2023 International Symposium on …, 2023 - dl.acm.org
The migration of atoms in metal interconnects in integrated circuits (ICs) increasingly
endangers chip reliability. The susceptibility of DC interconnects to electromigration has …

[图书][B] Electromigration Inside Logic Cells

G Posser, SS Sapatnekar, R Reis - 2017 - Springer
Electromigration (EM) in on-chip metal interconnects is a critical reliability-driven failure
mechanism in nanometer-scale technologies. Usually, works in the literature that address …

Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters

YH Yi, C Kim, C Zhou, A Kteyan… - 2023 IEEE International …, 2023 - ieeexplore.ieee.org
This work presents statistical data collected from 38 power grid test structures showing the
detailed impact of temperature gradient on electro migration (EM) lifetime. The failure time …

Characterization of Integrated Circuit Reliability and Security Using On-Chip Monitoring Circuits

C Zhou - 2018 - search.proquest.com
This thesis has thoroughly summarized my six years of PhD research works in Electrical and
Computer Engineering department, University of Minnesota. The novelty and contribution of …