The electrical resistance of interconnect wires increases with decreasing size, causing
signal delay and energy consumption that limits further downscaling of integrated circuits …

The increasing resistance of copper (Cu) interconnects for decreasing dimensions is a major
challenge in continued downscaling of integrated circuits beyond the 7 nm technology node …

As important artificial photosynthesis, the construction of core–shell heterojunction materials
is considered to be one of the effective strategies for designing highly active photocatalysts …

The advancement in semiconductor technology through the integration of more devices on a
chip has reached a point where device scaling alone is no longer an efficient way to improve …

Reduced dimensionality leads to emergent phenomena in quantum materials, and there is a
need for accelerated materials discovery of nanoscale quantum materials in reduced …

Topological semimetals (TSMs) possess topologically protected surface states near the
Fermi level with high carrier densities and high mobilities, holding distinct potential for low …

Topological nanowires, topological materials confined in one dimension, hold great promise
for robust and scalable quantum computing and low-dissipation interconnects, which will …

For more than a decade since their experimental confirmation, topological materials have
elicited interest from a wide variety of fields due to their unique symmetry-protected …

The harms caused by organic chlorides to the human body and the environment make the
problem of how to degrade organic chlorides particularly urgent. Phosphides have gradually …

Since their prediction and subsequent discovery, topological semimetals (TSMs) have
established a new research area, which includes the prediction of new semimetal phases …