Surface-roughness effect on capacitance and leakage current of an insulating film

YP Zhao, GC Wang, TM Lu, G Palasantzas… - Physical review B, 1999 - APS
Abstract Effects of surface roughness on electrical properties of a thin insulating film
capacitor with one smooth electrode plate and one rough electrode plate are investigated …

Native Silicon Oxide Properties Determined by Doping

M Della Ciana, A Kovtun, C Summonte, A Candini… - Langmuir, 2023 - ACS Publications
The physico-chemical properties of native oxide layers, spontaneously forming on crystalline
Si wafers in air, can be strictly correlated to the dopant type and doping level. In particular …

An Investigation of Electrical and Dielectric Parameters of Sol–Gel Process Enabled -Ga2O3 as a Gate Dielectric Material

A Kaya, H Mao, J Gao, RV Chopdekar… - … on Electron Devices, 2017 - ieeexplore.ieee.org
In this paper,-Ga 2 O 3 thin films were grown on a p-Si substrate using the sol–gel method.
Structural characterization of the films was performed using X-ray diffraction. Electrical …

Exceedingly high performance top-gate p-type SnO thin film transistor with a nanometer scale channel layer

TJ Yen, A Chin, V Gritsenko - Nanomaterials, 2021 - mdpi.com
Implementing high-performance n-and p-type thin-film transistors (TFTs) for monolithic three-
dimensional (3D) integrated circuit (IC) and low-DC-power display is crucial. To achieve …

Electrode defects in multilayer capacitors part I: modeling the effect of electrode roughness and porosity on electric field enhancement and leakage current

MM Samantaray, A Gurav, EC Dickey… - Journal of the …, 2012 - Wiley Online Library
Multilayer capacitors consist of multiple, often hundreds of capacitors connected in parallel
to maximize volumetric efficiency. As the dielectric and electrode layer thicknesses are …

Atomic layer etching of SiO2 for surface cleaning using ammonium fluorosilicate with CF4/NH3 plasma

Y Cho, Y Kim, S Kim, H Chae - … of Vacuum Science & Technology A, 2020 - pubs.aip.org
In this study, an atomic layer etching (ALE) process was developed and investigated for the
removal of SiO 2 with CF 4/NH 3. An ammonium fluorosilicate [AFS,(NH 4) 2 SiF 6] layer was …

Accounting for anomalous oxidation states of silicon at the Si/SiO2 interface

GF Cerofolini, C Galati, L Renna - Surface and Interface …, 2002 - Wiley Online Library
The early oxidation stages of hydrogen‐terminated single‐crystalline Si (100) exposed to a
diluted N2/N2O atmosphere at 850° C for different durations have been studied by XPS …

Fabrication of very high resistivity Si with low loss and cross talk

YH Wu, A Chin, KH Shih, CC Wu… - IEEE Electron …, 2000 - ieeexplore.ieee.org
We have used proton and As/sup+/implantation to increase the resistivity of conventional Si
(10/spl Omega/-cm) and Si-on-quartz substrates, respectively. A high resistivity of 1.6 M/spl …

Electrical performance of 28 nm-node varying channel-width nMOSFETs under DPN process treatments

SY Chao, WH Lan, SK Fan, ZW Zhon, MC Wang - Micromachines, 2022 - mdpi.com
The decoupled-plasma nitridation treatment process is an effective recipe for repairing the
trap issues when depositing high-k gate dielectric. Because of this effect, electrical …

[HTML][HTML] Electronic Properties of Atomic Layer Deposited HfO2 Thin Films on InGaAs Compared to HfO2/GaAs Semiconductors

IK Cashwell Jr, DA Thomas, JR Skuza, AK Pradhan - Crystals, 2024 - mdpi.com
This paper demonstrates how the treatment of III-V semiconductor surface affects the
number of defects and ensures the conformal growth of the high-k dielectric thin film. We …