Methods are provided for making a plurality of lidded microelectronic elements. In an
exemplary embodiment, a lid wafer is assembled with a device wafer. Desirably, the lid …

Capped chips and methods of forming a capped chip are provided in which electrical
interconnects are made by conductive elements which extend from bond pads of a chip at …

Packaged microelectronic elements are provided. In an exem plary embodiment, a
microelectronic element having a front face and a plurality of peripheral edges bounding the …

(57) ABSTRACT A capped chip is provided which includes a chip and a cap member, the
chip having a front Surface and a plurality of bond pads exposed at the front Surface, the cap …

A method of making a microelectronic assembly includes providing a microelectronic
element having a front face and contact pads accessible at the front face, providing a …

(57) ABSTRACT A method of making a plurality of sealed assemblies is provided which
includes a) assembling a first element to a second element so that a bottom surface of the …

Various embodiments of packaged chips and ways of fabricating them are disclosed herein.
One such packaged chip disclosed herein includes a chip having a front face, a rear face …

US PATENT DOCUMENTS 5,679,977 A 10, 1997 Khandros et al. 5,688,716 A 1 1/1997
DiStefano et al. 3,761,782 A 9, 1973 Youmans 5,703,400 A 12/1997 Wojnarowski et al …

(57) ABSTRACT A method of making the lidded chip assembly are provided which includes
the steps of:(a) aligning a lid member with a chip member including one or more chips So …

Lidded chip packages are provided in which an optoelectronic device chip has
microelectronic circuits exposed at a surface of the chip with a lid mounted to overlie the …