Pb-based solders have been the cornerstone technology of electronic interconnections for
many decades. However, with legislation in the European Union and elsewhere having …

Lead-free soldering has emerged as one of the key technologies for assembling in
environmental-conscious electronics. Among several candidate alloys, the Sn–Ag–Cu alloy …

Various factors affect the performance of electrical contacts, including tribological,
mechanical, electrical, and materials aspects. Although these behaviors have been studied …

Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used
extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi …

Minor alloying addition to solders has been an important strategy to improve the integrity
and reliability of Pb-free solders joint. In this study, the effects of 0.06 Ni and 0.5 Sb additives …

Tin (Sn)-based anodes for sodium (Na)-ion batteries possess higher Na-storage capacity
and better safety aspects compared to hard carbon-based anodes but suffer from poor cyclic …

Flip chip technology is increasingly an electronic packaging option in consumer products
because it can accommodate a large number of input/output interconnects in a small die …

SnAgCu (SAC) solder joints are widely used in electronic industry as alternative to lead free
solder. The microstructure of the solder joint plays an important role in enhancing the …

Sn–Bi solders may be applied for electronic applications where low-temperature soldering is
required, ie, sensitive components, step soldering and soldering LEDs. In spite of their …

The maximum bubble pressure method has been used to measure the surface tension of
pure Bi, surface tension and density of liquid binary Bi-Sn alloys (X Bi= 0.2, 0.4, 0.6, and 0.8 …