Materials, processing and reliability of low temperature bonding in 3D chip stacking
Due to the advantages of small form factor, high performance, low power consumption, and
high density integration, three-dimensional integrated circuits (3D ICs) have been generally …
high density integration, three-dimensional integrated circuits (3D ICs) have been generally …
Inhibition mechanism of palladium on intermetallic compounds in Au–Al bonding under high temperature storage
Z Liang, X Zhao, Y Li, Y Rao, K Wang… - Soldering & Surface …, 2024 - emerald.com
Purpose Adding Pd element to Au wire can improve the reliability of Au-Al bonding, but the
mechanism of Pd element has not been well revealed so far. The purpose of this study is to …
mechanism of Pd element has not been well revealed so far. The purpose of this study is to …
Characteristics and properties of Bi‐11Ag solder
R Koleňák, M Chachula - Soldering & Surface Mount Technology, 2013 - emerald.com
Purpose–The purpose of this paper is to study Bi‐11Ag solder for higher application
temperatures. The aim of the research work was to determine the soldering, thermal and …
temperatures. The aim of the research work was to determine the soldering, thermal and …
Structural size effect on mechanical behavior of intermetallic material in solder joints: Experimental investigation
L Ladani, O Abdelhadi - Journal of Electronic …, 2015 - asmedigitalcollection.asme.org
The elastic and plastic mechanical properties of intermetallic compound (IMC) phases of a
lead-free Sn3. 5Ag/Cu-substrate soldering system are investigated in different sized joints …
lead-free Sn3. 5Ag/Cu-substrate soldering system are investigated in different sized joints …
Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints
CF Lin, CM Chen, WP Dow, HH Liu… - IEEE Transactions …, 2014 - ieeexplore.ieee.org
A Sn-plated Cu lead is bonded with an Au bump to form an inner lead bonding (ILB) joint,
and the adhesion strength of the joint is examined using peeling test. Effects of bonding …
and the adhesion strength of the joint is examined using peeling test. Effects of bonding …