Huge differences between low-and high-angle twist grain boundaries: The case of ultrathin (001) Si films bonded to (001) Si wafers

JL Rouviere, K Rousseau, F Fournel… - Applied Physics …, 2000 - pubs.aip.org
Ultrathin 001 Si films bonded onto 001 Si wafers, inducing grain boundaries with twist
angles varying from 0.5 to 12, were studied by transmission electron microscopy. A great …

Stability of interfacial dislocations in (001) silicon surfacial grain boundaries

K Rousseau, JL Rouviere, F Fournel… - Applied physics …, 2002 - pubs.aip.org
Ultrathin (001) silicon films bonded onto (001) silicon wafers, which form “surfacial grain
boundaries” have been investigated by transmission electron microscopy. The samples …

Dislocation strain field in ultrathin bonded silicon wafers studied by grazing incidence x-ray diffraction

J Eymery, D Buttard, F Fournel, H Moriceau… - Physical Review B, 2002 - APS
An ultrathin silicon layer (16 nm) bonded onto a silicon wafer is studied by grazing incidence
x-ray diffraction. We measure satellite peaks around the {220} reflections coming from two …

Grazing incidence X-ray studies of twist-bonded Si/Si and Si/SiO2 interfaces

D Buttard, J Eymery, F Rieutord, F Fournel… - Physica B: Condensed …, 2000 - Elsevier
Twist-bonded Si/Si (001) and Si/SiO2 interfaces have been investigated by grazing
incidence X-ray scattering methods. For Si/Si (001) bonding, conventional X-ray reflectivity …

Toward two-dimensional self-organization of nanostructures using wafer bonding and nanopatterned silicon surfaces

D Buttard, J Eymery, F Fournel, P Gentile… - IEEE journal of …, 2002 - ieeexplore.ieee.org
The structure of ultrathin silicon layers obtained by molecular hydrophobic bonding is
investigated. The twist and tilt angles between the two crystals are accurately controlled. The …

[PDF][PDF] Ultrathin Porous Silicon Films

B Bessaïs - Handbook of Porous Silicon, 2018 - academia.edu
Investigations of the structure and morphology of ultrathin PS films are reviewed, of
relevance to the technological control of miniaturized PS-based devices. Several …

Strain in hydrogen and oxygen implanted silicon and SOI structures annealed at high pressure

J Bak-Misiuk, IV Antonova, A Misiuk… - Journal of alloys and …, 2001 - Elsevier
Effect of annealing up to 1400 K under argon pressure up to 1.2 GPa (HT-HP treatment) on
silicon implanted with hydrogen (Si: H), oxygen (Si: O) and on silicon-on-insulator (SOI) …

Alternate dissociation of the screw dislocations in a (0 0 1) buried small-angle twist boundary in silicon

R Bonnet, M Loubradou, S Youssef… - Philosophical …, 2009 - Taylor & Francis
The square dislocation network of a (0 0 1) buried small-angle boundary in silicon was
observed by dark-field transmission electron microscopy to examine the structures of more …

Dislocation Networks Strain Fields Induced By Si Wafer Bonding.

J Eymery, F Fournel, K Rousseau, D Buttard… - MRS Online …, 2001 - cambridge.org
Buried dislocation superlattices are obtained by bonding ultra-thin single crystal Si (001)
films on Si (001) wafers. The twist of two Si wafers induces a regular square grid of …

High mobility electron heterostructure wafer fused onto LiNbO3

KJ Friedland, A Riedel, H Kostial, M Höricke… - Journal of electronic …, 2001 - Springer
Abstract An (Al, Ga) As heterostructure consisting of a 10 nm wide GaAs single quantum well
and an optimized AlAs/GaAs type-II-superlattice barrier is fused onto a new LiNbO 3 …