Abstract The reliability of Sn-Ag-Cu (SAC)-based solder alloys has been extensively
investigated after the prohibition of lead in the electronics industry owing to their toxicity. Low …

Since the restriction of hazardous substances (RoHS) directive, lead-free soldering has
been widely broad adopted. In many applications, lead-free alloys have been substituted for …

This study aims to comprehensively understand the influence of bismuth (Bi) content on the
shear characteristics of solder joints under various aging conditions and strain rates. Three …

Reliability of microelectronic assemblies is typically limited by the fatigue failure of one of the
interconnected solder joints. The fatigue behavior of the lead-free solder joints doped with …

Recent studies demonstrate significant reductions in mechanical properties of lead-free
interconnection materials in harsh environments such as automotive and military …

During operation, electronic components are exposed to high temperatures that may last for
long periods, depending on the operating duration. Solder joints are one of the components …

ABSTRACT A significant reliability problem with the baseline alloy SAC305 is the
deterioration of their mechanical properties and recrystallization of the microstructure after …

As an environmentally friendly interconnection material in power electronics, silver paste is
widely used in gold surface finish. To explain the delamination at the Ag-Au interface and …

Ball shear testing is an efficient approach to investigate the mechanical reliability of solder
joints at the structural level. In the present study, a series of low-speed ball shear tests were …

Printed circuit board (PCB) is widely used in electronic packaging and plays a role in
supporting the electronic components by providing electrical connections for the circuit's …