R Bajaj, D Redfield, MC Orilall, FU Boyi… - US Patent …, 2022 - Google Patents
Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same …
A Kumar, A Chockalingam, S Ganapathiappan… - US Patent …, 2022 - Google Patents
Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized …
J Chen, H Liu - US Patent 7,244,407, 2007 - Google Patents
(57) ABSTRACT A new, non-wrapping approach to Solubilize nanotubes. Such as carbon nanotubes, in organic and inorganic solvents is provided. In accordance with certain …
R Mavliev, B Swedek, A Wiswesser… - US Patent App. 10 …, 2005 - Google Patents
BACKGROUND 0001. The present invention relates to methods and appa ratus for monitoring a metal layer on a Substrate during electro-chemical mechanical polishing. 0002 …
K Krishnan, D Redfield, RE Perry, GE Menk… - US Patent …, 2024 - Google Patents
A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a …
CM Sung - US Patent 9,011,563, 2015 - Google Patents
4.228, 214. A 10/1980 Steigelman et al. 5.453, 106 A 9, 1995 Roberts........................... 5 1/307 4,229, 186 A 10, 1980 Wilson 5,454,343 A 10, 1995 Eun et al. 4,273,561 A 6, 1981 …
(51) Int. Cl.(57) ABSTRACT HOI. I./62(2006.01)-0 A binder material, inorganic polymer, is used to formulate (52) US Cl........... 313495. 428/403: 445/50: 427/78 carbon nanotube …
CM Sung - US Patent 8,974,270, 2015 - Google Patents
CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a CMP pad dresser can include a matrix layer and a monolayer of a plurality of …
A Duboust, S Chang, W Lu, S Neo, Y Wang… - US Patent …, 2011 - Google Patents
(57) ABSTRACT A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing Surface, a first thickness, a first …