Solder is widely used to connect chips to their packaging substrates in flip chip technology
as well as in surface mount technology. At present, the electronic packaging industry is …

Solder reactions between SnPb and one of the four metals, Cu, Ni, Au, and Pd have been
reviewed on the basis of the available data of morphology, thermodynamics, and kinetics …

Aqueous acidic batteries are a good choice to respond to battery diversity, delivering safety,
cost, environmental friendliness, and high-power necessary for renewable energy storage …

Sn-rich alloys in the Sn-Ag-Cu system are being studied for their potential as Pb-free
solders. Thus, the location of the ternary eutectic involving L,(Sn), Ag 3 Sn and Cu 6 Sn 5 …

Systematic experiments have been performed to study the intragranular nucleation
phenomena of ferrite in Ti-bearing low carbon steels. The fine intragranular acicular ferrite …

Intermetallic compound (IMC) growth during solid-state aging at 125, 150, and 170° C up to
1500 h for four solder alloys (eutectic SnPb, Sn–3.5 Ag, Sn–3.8 Ag–0.7 Cu, and Sn–0.7 Cu) …

The tracer diffusion coefficients of the elements as well as the integrated interdiffusion
coefficients are determined for the Cu 3 Sn and Cu 6 Sn 5 intermetallic compounds using …

The growth behavior of intermetallic compounds (IMCs) at the liquid-solid interfaces in
Cu/Sn/Cu interconnects during reflow at 250° C and 280° C on a hot plate was investigated …

The purpose of this article is to give a set of recommendations to producers of assessed
thermodynamic data, who may be involved in either the critical evaluation of limited …

In 3D IC technology, when the size of the micro-bump solder joint is reduced to 10 µm, the
scallop-type Cu 6 Sn 5 grains on opposite sides of the joint can interact directly by …