In the automotive industry, the design and implementation of power converters and
especially inverters, are at a turning point. Silicon (Si) IGBTs are at present the most widely …

Transportation electrification in many forms along with continued grid modernization efforts
is placing stringent requirements on volumetric and gravimetric power densities for power …

Flip-chip packaging technology is widely employed in various electronic products, and its
thermal performance plays is crucial in determining the overall efficacy of these devices. The …

In the current vehicle electric propulsion systems, the thermal design of power modules
heavily relies on empirical knowledge, making it challenging to effectively optimize …

Power modules are the core components of the powertrain of hybrid and battery electric
vehicle (EV) and has a significant impact on system performance and reliability …

Lateral gallium nitride (GaN) high-electron-mobility transistors present better electrical
characteristics compared to silicon or silicon carbide devices such as high switching speed …

This review explores the performance and reliability of power semiconductor devices
required to enable the electrification of heavy goods vehicles (HGVs). HGV electrification …

Power module packaging technologies are undergoing extensive changes to satisfy
compact high-power-density systems. The advantages of double-sided cooling power …

Low-profile double-side cooled power modules are emerging in electric-drive inverters to
achieve higher power density and efficiency. However, the rigid interconnection between the …

The double-side cooling (DSC) packaging becomes more and more popular with the great
demands of high power and fast speed, especially for silicon carbide metal oxide …