Thin copper substrates with high flatness and surface integrity are highly required in
precision physical experiments. Normally, fly cutting is used to fabricate the substrates …

Double-sided lapping process is a key technology for obtaining high efficiency and flatness
in fabricating plane-parallel workpiece surfaces, such as wafers, optical windows, seal rings …

The lapping process is strongly affected by a number of input parameters. One of the
fundamental mechanical processes in lapping is the abrasive effect of particles. In order to …

This study aims to investigate the effect of application of the lapping process on the amount
of axis misalignment in elliptical spur gears. Using a Taguchi L 9 experimental design, nine …

Double-sided lapping (DSL) is always employed as a precision process for machining flat
workpieces, such as optical windows, wafers, and brake pads taking advantage of its high …

近年来, 随着半导体, 光学制造等领域的飞速发展, 对晶圆, 光学窗口及密封环等薄平板件的需求
越来越大, 加工质量要求越来越高. 双面研磨具有加工应力小, 效率高等优点 …

Two-side end grinding is widely used for machining end surfaces of various parts. In all
methods of two-side end surface grinding, the wheel is aligned with the end surface …

For the miniaturization of the structures of semiconductor device fabrication, high uniformity
of side-flatness and edge roll-off of 300 mm wafers are required. In this study, the formation …

In recent years, semiconductor and optical manufacturing fields have experienced rapid
development, leading to a heightened demand for thin flat components, such as wafers …

The grind-polishing wheel is a new non-woven structure grinding tool with low elastic
modulus and ultra-fine abrasive grains, which can obtain high surface/sub-surface quality …