This paper reviewed the state-of-art copper pillar technology in flip-chip packaging, driven
by the semiconductor industry's demands for thinner and faster data transmission. This …

The thermomechanical reliability of surface mount components (SMCs) is closely related to
the reflow soldering process. With the rise of board complexity, an optimal reflow profile must …

Energy recovery from waste printed circuit boards (PCBs) was carried out by using
microwave pyrolysis. According to thermogravimetric analysis, the maximum weight loss rate …

Recycling of waste printed circuit boards (PCBs) has attracted increasing attention because
of its high annually produced amount and high content of gold. In this study, gold recovery …

Uneven temperature distribution poses a big challenge on reflow soldering of surface mount
components. Particularly, when components with different thermal mass are mounted on a …

This paper presents a physics-guided machine learning model to provide the optimal reflow
recipe for a 7-zone oven. The numerical method based on the computational fluid dynamics …

Surface mount technology (SMT) is a method of electronic components mounting or placed
directly on the surface of the circuit board. The solder will be printed onto the substrate on …

This paper investigates the impact of various copper (Cu) pillar bump heights on
temperature distribution, deformation and thermal stress during reflow. The virtual reflow …

This paper proposes refined packaging techniques to improve the yield of a 13 kV silicon
carbide (SiC) MOSFET power module. The refinements explicitly focus on molybdenum (Mo) …

The process design of hot air reflow soldering is one of the key factors affecting the quality of
PCBA (Printed Circuit Board Assembly) component products. In order to improve the product …