A promising technique for the large-scale manufacture of micro-fluidic devices and photonic
devices is hot embossing of polymers such as PMMA. Micro-embossing is a deformation …

This paper proposes the use of multivariable control methods to design a thermal platform
for processing semiconductor substrates (semiconductor wafers and/or quartz reticles for …

The major research focus on integrated circuits (ICs) mainly deals with increasing circuit
performance and functional complexity of circuit. The lithography process is the most critical …

We proposed an in situ method to control the steady-state wafer temperature uniformity
during thermal processing in microlithography. Thermal processing of wafer in the …

The microlithography process is the most critical step in the fabrication of nanostructures for
integrated circuit manufacturing. The most important variable in the microlithography …

A programmable multizone thermal-processing module is developed to achieve wafer-
temperature uniformity during the thermal-cycling process in lithography. The bake and chill …

Wafer warpage is common in microelectronics processing. Warped wafers can affect device
performance, reliability and linewidth control in various processing steps. We proposed in …

This paper describes a novel approach for the control of the entire photolithography track
using a combination of two methods: genetic programming (GP) and nonlinear model …

A novel approach to improve photoresist thickness uniformity after the conventional spin-
coating and softbake process is proposed in this paper. Using an array of thickness sensors …

A feedforward control scheme is designed to improve performance of conductive heating
systems used for lithography in microelectronics processing. It minimizes the loading effects …