3D integration opens up new opportunities for future multiprocessor chips by enabling fast
and highly scalable 3D Network-on-Chip (NoC) topologies. However, in an aim to reduce …

Three-dimensional networks on chip (3D-NoCs) have been proposed as an enormously
scalable solution to address communication problems in modern systems on chip. Through …

3D integration opens up new opportunities for future multiprocessor chips by enabling fast
and highly scalable 3D Network-on-Chip (NoC) topologies. However, in an aim to reduce …

Multiprocessor systems-on-chip (MPSoCs) based on 3-D networks-on-chip (3D-NoCs) are
crucial architectures for robust parallel computing, efficiently sharing resources across …

The combined benefits of the Three-Dimensional (3D) and Network-on-Chip (NoC) schemes
enable designing a high-performance system in a limited chip area. The 3D-NoC major …

Abstract 3D integration is a practical solution for overcoming the problems of long and slow
global wires in current and future generations of integrated circuits. This emerging …

Three-dimensional Networks-on-Chip (3D-NoC) have emerged as an effective solution to
the scalability and latency issues in modern complex System-On-Chips. Through-Silicon Via …

Networks-on-Chips (NoCs) have found wide acceptance in many-core systems for on-chip
communication due to their ease in addressing communication problems in integrated …

Networks-on-Chip (NoC) have emerged as a viable solution for the communication
challenges in highly complex Systems-on-Chip (SoC). The NoC architecture paradigm …

Networks-on-Chip (NoCs) have proven to be a fast and scalable replacement for buses in
current and emerging many-core systems. They are today an actively researched topic and …