The trend of continuing miniaturisation of microelectronics leads to new thermal
management challenges. A key point in the heat removal process development is to improve …

We review the current state-of-the-art graphene-enhanced thermal interface materials for the
management of heat in the next generation of electronics. Increased integration densities …

Thermal management is becoming a critical technology challenge for modern electronics
with decreasing device size and increasing power density. One key materials innovation is …

As temperature cycling drives fatigue failure of solder joints in electronic modules,
characterisation of the thermal fatigue response of different solder alloy formulations in BGA …

Recent years have witnessed a staggering escalation in the power density of modern
electronic devices. Because increasingly high power density accumulates heat, efficient …

Increasing power densities within microelectronic systems place an ever increasing demand
on the thermal management. Thermal interface materials (TIMs) are used to fill air gaps at …

High-power light-emitting diode (LED) chip-scale packages (CSPs) prepared by the flip-chip
technology have become one of the most promising light sources. The die attach solder …

Fatigue of lead-free solder joints remains the most critical concern in thermo-mechanical
reliability of high power modules. Due to size miniaturization requirements, fatigue …

Process-induced solder voids have three-dimensional shapes and show spatially random
distribution with polydisperse geometric dimensions. There exists no analytical formulation …

Thermal properties of thermally conductive epoxy based composites are mainly influenced
by their formulation and thermal processing. The present study is intended to develop an …