The key role that underfill materials play in highly reliable, advanced flip chip organic
packages has generated an increased focus on their behavior and structure. One such …

Underfills containing filler particles exhibit filler settling during the (capillary-based) wicking
and curing processes, thus causing the reliability estimation to deviate from that of the …

As microelectronic packaging technology is developed toward miniaturization and high
density, flip chip is one of the most accepted packaging forms at present. In order to solve …

Thin and filled with the through-silicon cupper via (TSV) array, silicon interposers are key to
vertical integration of chips for denser packaging. TSVs reduce the trace length by directing …

Thermomechanical reliability of solder joints in flip-chip packages is usually analyzed by
assuming a homogeneous underfill ignoring the settling of filler particles. However, filler …

Afin de protéger les interconnexions dans les assemblages, une couche de matériau
d'underfill est utilisée pour remplir le volume et fournir un support mécanique entre la puce …

Cold-joint defect has been critically discussed in flip chip interconnections, especially for
lead-free solder and Cu pillar bumps in fcFBGA (flip chip fine-pitch BGA). In the case of Cu …

In the capillary-flow underfilling process many practical evidences suggest that the
distribution of fillers is not uniform as is usually assumed. It is likely caused by filler …

In the electronics industry, filler particles are added to the epoxy to form a composite material
in order to adjust the elastic modulus and the coefficient of thermal expansion (CTE). This …