During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used
extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi …

This study reviews the existing research on the effects of surface roughness on the
wettability and intermetallic compound (IMC) layer formation in lead-free solder joints. The …

Abstract Nanocomposite Sn-Bi solders received noticeable attention for flexible electronics
due to their improved mechanical properties. The main limitation is the dispersion of …

In the present study, the effect of Al 2 O 3 nanoparticles on performances of Sn–58Bi solder
were investigated in aspects of electro-migratio, shear strength and microhardness. The …

This paper investigates the effects of different weight percentages (0, 0.5, 1.0, 1.5 and 2.0
wt.%) of kaolin geopolymer ceramic (KGC) on the microstructure formation, thermal …

Abstract Sn57. 6Bi0. 4Ag solder has been reinforced successfully through the addition of
tungsten (W) nanoparticles at a concentration of 0.5 wt%. With the addition of W …

The ZnO nanoparticles were added to improve the wettability and mechanical properties of
In-45.6 Sn-5Bi (ISB) solder alloy. The wetting angle decreased from 48.9° to 38.6° with 0.05 …

Mini light-emitting diodes (mini-LEDs) with high contrast and brightness have the potential to
compete with modern organic light-emitting diodes in consumer appliances and flexible …

In the artificial intelligence (AI) era, adopting low-temperature soldering technology serves
the dual purpose of meeting carbon-neutral demands and mitigating warpage issues in …