Highly thermally conductive epoxy composites with AlN/BN hybrid filler as underfill encapsulation material for electronic packaging
WA Lee Sanchez, JW Li, HT Chiu, CC Cheng… - Polymers, 2022 - mdpi.com
In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN
particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were …
particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were …
Modeling of interfacial multi-cracks in dissimilar laminated structures using a nodal-based Lagrange multiplier/cohesive zone approach
Recent decades have witnessed a growing interest in simulating interfacial debonding in
laminated structures using cohesive zone (CZ)-based algorithms. In the present work, we …
laminated structures using cohesive zone (CZ)-based algorithms. In the present work, we …
On the influence of lid materials for flip-chip ball grid array package applications
MB Jeronimo, J Schindele, H Straub, PJ Gromala… - Microelectronics …, 2023 - Elsevier
Autonomous driving is a key vehicle capability for future mobility solutions that relies on the
reliability of its high-performance vehicle computer. As for any electronics for automotive …
reliability of its high-performance vehicle computer. As for any electronics for automotive …
Modeling of flip-chip underfill delamination and cracking with five input manufacturing variables
The chip corner geometry and the mismatch of the coefficient of thermal expansion cause a
local stress concentration in the underfill near the chip corner area. Delamination at the chip …
local stress concentration in the underfill near the chip corner area. Delamination at the chip …
三维裂纹扩展的自适应虚拟节点法.
冯泽洋， 段庆林， 陈蒿涛 - Chinese Journal of Computational …, 2024 - search.ebscohost.com
在有限元方法的框架下针对三维裂纹扩展问题发展了自适应虚拟节点法. 该方法采用无需裂尖
加强函数(和相应的额外自由度) 的虚拟节点技术描述裂纹处的间断, 并采用单元局部水平集方法 …
加强函数(和相应的额外自由度) 的虚拟节点技术描述裂纹处的间断, 并采用单元局部水平集方法 …
Prediction of Crack Initiation at Die Corner of Molded Underfill Flip-Chip Packages Under Thermal Load by New Criteria—Part I: Accurate Formulation of Singular …
GC Lyu, XP Zhang, MB Zhou, CB Ke… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
The present study provides solutions for the stress and strain fields near the junction formed
at the intersection of the inclusion and matrix interfaces under thermal load. It further …
at the intersection of the inclusion and matrix interfaces under thermal load. It further …
Effect of Tg and modulus on the underfill reliability in package
G Zhao, H Lin, X Peng, P Zhu… - 2023 IEEE 25th …, 2023 - ieeexplore.ieee.org
With the continuous improvement of the process level of integrated circuits, more and more
chips are integrated into single package device, which promotes the development of …
chips are integrated into single package device, which promotes the development of …