Moisture diffusion modeling–A critical review
EH Wong, SB Park - Microelectronics Reliability, 2016 - Elsevier
Techniques for enforcing the continuity of solute field in heterogeneous solvent under the
conditions of steady temperature-humidity, steady temperature but dynamic humidity, and …
conditions of steady temperature-humidity, steady temperature but dynamic humidity, and …
Comprehensive study on 2.5 D package design for board-level reliability in thermal cycling and power cycling
2.5 D packages have been widely used in electronics industry for high performance and
product miniaturization. As Through-Silicon-Via (TSV) fabrication methods and multi-level …
product miniaturization. As Through-Silicon-Via (TSV) fabrication methods and multi-level …
[HTML][HTML] Finite element analysis of hydrogen retention in ITER plasma facing components using FESTIM
R Delaporte-Mathurin, EA Hodille, J Mougenot… - Nuclear Materials and …, 2019 - Elsevier
The behaviour of hydrogen isotopes in ITER monoblocks was studied using the code
FESTIM (Finite Element Simulation of Tritium In Materials) which is introduced in this …
FESTIM (Finite Element Simulation of Tritium In Materials) which is introduced in this …
A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow
Moisture induced failure is one of the major reliability concerns in electronic packaging. This
research provides a comprehensive solution for modeling the moisture induced …
research provides a comprehensive solution for modeling the moisture induced …
Fiber packing and morphology driven moisture diffusion mechanics in reinforced composites
Fiber reinforced polymer composite (FRPC) materials are extensively used in lightweight
applications due to their high specific strength and other favorable properties including …
applications due to their high specific strength and other favorable properties including …
Modeling and design of 2.5 D package with mitigated warpage and enhanced thermo-mechanical reliability
The objective of this research is to investigate the design factors that contribute to the
thermal deformation and stress development of lidless 2.5 D package, and to provide design …
thermal deformation and stress development of lidless 2.5 D package, and to provide design …
[HTML][HTML] Moisture diffusion in multi-layered materials: The role of layer stacking and composition
Multi-layered materials are everywhere, from fiber-reinforced polymer composites (FRPCs)
to plywood sheets to layered rocks. When in service, these materials are often exposed to …
to plywood sheets to layered rocks. When in service, these materials are often exposed to …
Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions
The normalization approach has been accepted as a routine to overcome the concentration
discontinuity at multi-material interfaces in the moisture diffusion simulation by the finite …
discontinuity at multi-material interfaces in the moisture diffusion simulation by the finite …
Influence of interface conditions on hydrogen transport studies
R Delaporte-Mathurin, EA Hodille, J Mougenot… - Nuclear …, 2021 - iopscience.iop.org
This work investigates the influence of hydrogen chemical potential continuity across solid
material interfaces. The implementation of the mathematical model in FESTIM is verified …
material interfaces. The implementation of the mathematical model in FESTIM is verified …
[HTML][HTML] Parametric optimisation based on TDS experiments for rapid and efficient identification of hydrogen transport materials properties
R Delaporte-Mathurin, EA Hodille, J Mougenot… - Nuclear Materials and …, 2021 - Elsevier
A novel identification technique of hydrogen transport parameters using FESTIM (Finite
Element Simulation of Tritium In Materials) has been demonstrated. FESTIM is a finite …
Element Simulation of Tritium In Materials) has been demonstrated. FESTIM is a finite …