G Zhanshe, C Fucheng, L Boyu, C Le, L Chao… - Microsystem …, 2015 - Springer
Micro-electromechenical Systems (MEMS) gyroscope is widely used in many occasions to measure the angular speed of the moving objects and attracts the attentions of many …
WM Van Spengen - Journal of Micromechanics and …, 2012 - iopscience.iop.org
This paper presents a comprehensive review of the reliability issues hampering capacitive RF MEMS switches in their development toward commercialization. Dielectric charging and …
P Sharma, N Kaushik, H Kimura, Y Saotome… - …, 2007 - iopscience.iop.org
Completely glassy thin films of Zr–Al–Cu–Ni exhibiting a large supercooled liquid region (ΔT x= 95 K), very smooth surface (R a= 0.2 nm) and high value of Vickers hardness (H v= 940) …
T Connolley, PE Mchugh… - Fatigue & Fracture of …, 2005 - Wiley Online Library
Mechanical devices are being introduced whose size scale is well below that of conventional mechanical test specimens. The smallest devices have sizes in the nanometer …
The continuous miniaturization of modern electromechanical systems calls for a comprehensive understanding of the mechanical properties of metallic materials specific to …
The growth stress generated once grains coalesce in Volmer-Weber-type thin films is investigated by time-multiscale simulations comprising complementary modules of (i) finite …
Charge injection and retention in thin dielectric layers remain critical issues for the reliability of many electronic devices because of their association with a large number of failure …
Time-dependent mechanical investigations of on-wafer specimens are of interest for improving the reliability of thin metal film microdevices. This paper presents a novel …
Abstract High strength Ni matrix TiO 2 composites are prepared by co-electrodeposition with an electrolyte composed of Ni Watts bath, surfactants, CO 2 in the supercritical fluid state …