Thermal conduction in polymeric materials and across interfaces is of considerable scientific
and technological importance nevertheless only very few studies are available without …

Interfacial thermal resistance is the primary impediment to heat flow in materials and devices
as characteristic lengths become comparable to the mean‐free paths of the energy carriers …

The coupled interactions among the fundamental carriers of charge, heat, and
electromagnetic fields at interfaces and boundaries give rise to energetic processes that …

Phononic crystals (PnCs) are the acoustic wave equivalent of photonic crystals, where a
periodic array of scattering inclusions located in a homogeneous host material causes …

The efficiency in modern technologies and green energy solutions has boiled down to a
thermal engineering problem on the nanoscale. Due to the magnitudes of the thermal mean …

The accuracies of two theoretical expressions for thermal boundary resistance are assessed
by comparing their predictions to independent predictions from molecular dynamics (MD) …

The development of GaN-on-diamond devices holds much promise for the creation of high-
power density electronics. Inherent to the growth of these devices, a dielectric layer is placed …

High-power GaN-based electronics are limited by high channel temperatures induced by
self-heating, which degrades device performance and reliability. Increasing the thermal …

Thermal boundary resistance dominates the thermal resistance in nanosystems since
material length scales are comparable to material mean free paths. The primary scattering …

The need for increased control of layer thickness and uniformity as device dimensions shrink
has spurred increased use of atomic layer deposition (ALD) for thin film growth. The ability to …