Reliability is one of the most challenging problems in the context of three-dimensional
network-on-chip (3D NoC) systems. Reliability analysis is prominent for early stages of the …

Silicon nanophotonics, with its high-speed, low-loss optical interconnects, and high
computation capabilities, is seen as one of the promising technologies that can easily …

Through silicon vias (TSVs) play an important role as the vertical electrical connections in 3-
D stacked integrated circuits. However, the closely clustered TSVs suffer from the crosstalk …

One of the cost-efficient fabrication approaches for connecting layers in three-dimensional
integrated circuits (3D ICs) is the use of through-silicon vias (TSVs). However, the large and …

TSV-to-TSV coupling is known to be a significant detriment to signal integrity in three-
dimensional (3D) IC architectures. Designing a reliable Through-Silicon Via is critical in …

A 3-D multiple-stacked IC has been proposed to support energy efficiency for data center
operations as dynamic RAM (DRAM) scaling improves annually. 3-D multiple-stacked IC is a …

TSV-to-TSV capacitive coupling has large disruptive effects on timing requirements of the
circuit. The latency effect of TSV-to-TSV capacitive coupling for different characteristics of a …

TSV-based 3D-NoC has been introduced as a viable solution for integrating more cores on
a chip, while imposing smaller footprint area and better timing performance as compared to …

Migration to Three Dimensional Integrated Circuits (3D ICs) can provide higher scalability,
higher throughput, and lower power consumption with respect to Two Dimensional …

Many-core systems are of great importance for building the exascale computing machine
targeted for 2020. Last-Level Cache (LLC), as the largest on-chip shared memory in many …