GaAs Thermally Based MEMS Devices—Fabrication Techniques, Characterization and Modeling: MEMS Device Design and Fabrication MEMS Device Thermo …

T Lalinský, M Držík, J Jakovenko, M Husák - MEMS/NEMS: Handbook …, 2006 - Springer
Abstract Silicon (Si) based MicroElectroMechanical Systems (MEMS) are now well
understood and widely used in various integrated micromachined microsensors and …

Web-Enabled Knowledge-Intensive Support Framework for Collaborative Design of MEMS

XF Zha - MEMS/NEMS: Handbook Techniques and Applications, 2006 - Springer
Abstract Micro-Electro-Mechanical Systems (MEMS) design and manufacturing are
inherently multi-physical and multi-disciplinary; no single person is able to perform a full …

[PDF][PDF] Characterization of MEMS sensor for RF transmitted power measurement

J Jakovenko, M Husak - WSEAS Transactions on Electronics, 2006 - Citeseer
In this report we introduce the procedure for performing a thermo mechanical design and
analysis of thermal GaAs-based MEMS devices. It will provide the procedure how thermal …

Detection of inhomogeneities in a metal cylinder using ESPI and 3D pulsed Digital Holography

T Saucedo-Anaya, FM Santoyo… - Sixth International …, 2004 - spiedigitallibrary.org
ESPI and 3D pulsed Digital Holography have been applied to detect inhomogeneities inside
a metal cylinder. A shaker was employed to produce a mechanical wave that propagates …

[PDF][PDF] Thermally Isolated MEMS Thermo Converter for RF Power Sensor

J JAKOVENKO, M HUSAK, T LALINSKY - Citeseer
This report discusses the design of Thermo-mechanical converter that creates heart of the
RF power sensor microsystem. The conception of absorbed power measurement is based …

Modeling of GaAs MEMS for RF power measurement in telecommunications

J Jakovenko, M Husak - Proceedings of the 4th WSEAS International …, 2005 - dl.acm.org
This report discusses the design of Thermo-mechanical converter that creats heart of the RF
power sensor microsystem which can be used for transmitted power measurement in …

[引用][C] Design and Simulation of The GaAs Micromechanical Thermal Converter for Microwave Transmitted Power Sensor

J Jakovenko, M Husak, T Lalinsky - Proceedings of Nanotechnology Conference, 2003

[引用][C] Thermo-mechanical Simulations of GaAs Based Microwave Power Sensor Microsystem

J Jakovenko, M Husak, T Lalinsky

[引用][C] THERMO-MECHANICAL OPTIMIZATION OF MICROMECHANICAL HOT PLATE FOR RF POWER TO TEMPERATURE CONVERSION

J Jakovenko, M Husak, T Lalinsky - 2005

[引用][C] Optimization of GaAs MEMS structures for Microwave Power Sensor

J Jakovenko, M Husak, T Lalinsky - v NSTI Nanotechnology Conference and Trade …, 2005