ST Kadam, R Kumar - International Journal of Thermal Sciences, 2014 - Elsevier
Due to rapid evolution in a wide range of technologies in twentieth century, heat dissipation requirement has increased very rapidly especially from compact systems. There is an urgent …
Abstract Microchannel Heat Sink (MCHS) has been widely adopted in thermal engineering fields, such as refrigerators, chip cooling, battery packs, etc. To meet the ever-increasing …
In this review, the heat transfer characteristics of several pumped two-phase electronic cooling technologies are quantitatively examined and compared on the basis of heat flux …
Y Lin, Y Luo, J Li, W Li - International Journal of Heat and Mass Transfer, 2021 - Elsevier
The micro-structured surfaces have a significant impact on the flow patterns and heat transfer mechanisms during the flow boiling process. As illustrated by previous studies, there …
The rising heat dissipation requirement on electronic devices urges a more efficient and energy-saving cooling strategy to keep the equipment operating within a safe temperature …
T Hao, H Ma, X Ma - International Journal of Heat and Mass Transfer, 2019 - Elsevier
The startup mechanism, temperature oscillation, liquid slug oscillation, and heat transfer performance of polytetrafluoroethylene (PTFE)-based oscillating heat pipes (OHPs) are …
AH Al-Zaidi, MM Mahmoud, TG Karayiannis - International Journal of Heat …, 2022 - Elsevier
The substrate material and active side characteristics can affect the bubble ebullition cycle and consequently the heat transfer rate and pressure drop in microchannel evaporators …
Copper, due to its ease of machining and high thermal conductivity, is the most commonly used substrate for heat sink applications. This paper presents an experimental investigation …
In Part II of this study, we report that pressure drop was reduced by approximately 48% and critical heat flux (CHF) was increased by approximately 300% in SiNW microchannels …