Progress, challenges and potentials/trends of tungsten-copper (WCu) composites/pseudo-alloys: Fabrication, regulation and application

Y Wang, L Zhuo, E Yin - International Journal of Refractory Metals and …, 2021 - Elsevier
Tungsten‑copper (Wsingle bondCu) composites/pseudo alloys with excellent properties are
extremely desirable for applications as electrode materials, functional graded materials …

Recent progress in development of tungsten-copper composites: Fabrication, modification and applications

LL Dong, M Ahangarkani, WG Chen… - International Journal of …, 2018 - Elsevier
Tungsten copper (W-Cu) composites, as a traditional refractory material, are promising
materials for manufacture of electrical contacts and electrodes, heavy duty electronic …

Preparation and properties of multiphase solid-solution strengthened high-performance W–Cu alloys through alloying with Mo, Fe and Ni

H Zhang, XC Deng, GH Zhang - Materials Science and Engineering: A, 2023 - Elsevier
In this study, high performance W–Mo–Cu–Ni–Fe alloy samples with additions of Mo (0–6
wt%), Ni and Fe (total content: 2.5 wt% and 5 wt%) were obtained through liquid-phase …

Preparation and properties of W-30 wt% Cu alloy with the additions of Ni and Fe elements

H Zhang, JR Liu, GH Zhang - Journal of Alloys and Compounds, 2022 - Elsevier
In this paper, excellent performance W-Cu-Ni-Fe alloys with the addition of Ni and Fe (total
content: 5 wt%) were successfully prepared by low temperature liquid-phase sintering, using …

Experimental investigations on the synthesis of W–Cu nanocomposite through spark plasma sintering

A Elsayed, W Li, OA El Kady, WM Daoush… - Journal of Alloys and …, 2015 - Elsevier
Elemental powders of nanosized tungsten and chemically deposited nanosized copper
were used for preparing tungsten/copper composites, which are used as electric contact …

Investigation on arc erosion behaviors and mechanism of W70Cu30 electrical contact materials adding graphene

L Dong, W Chen, N Deng, J Song, J Wang - Journal of Alloys and …, 2017 - Elsevier
In this work, graphene was chosen to add into W70Cu30 alloys to develop properties of arc
erosion. The effect of graphene addition on arc ablation behavior of W70Cu30 contacts was …

Direct diffusion bonding of immiscible tungsten and copper at temperature close to Copper's melting point

J Zhang, Y Huang, Y Liu, Z Wang - Materials & Design, 2018 - Elsevier
In this study, a direct diffusion bonding method is designed to bond tungsten (W) and copper
(Cu) without using an interlayer metal at a temperature close to the melting point of copper …

Effect of spark plasma sintering temperature on structure and performance characteristics of Cu-20wt% W composite

X Li, M Zhang, G Zhang, S Wei, L Xu, Y Zhou - Journal of Alloys and …, 2022 - Elsevier
Spark plasma sintering (SPS) is a promising method for producing high performance Cu-W
composite with high copper and low tungsten content, which has wide application space in …

From solid solutions to fully phase separated interpenetrating networks in sputter deposited “immiscible” W–Cu thin films

FTN Vüllers, R Spolenak - Acta Materialia, 2015 - Elsevier
W–Cu alloys are typically used for heat sinks, radiation shielding or high performance
contact materials. Their immiscibility leads to interpenetrating structures, with typically …

The thermo-mechanical behaviour of W-Cu metal matrix composites for fusion heat sink applications: The influence of the Cu content

E Tejado, AV Müller, JH You, JY Pastor - Journal of Nuclear Materials, 2018 - Elsevier
Copper and its alloys are used as heat sink materials for next generation fusion devices and
will be joined to tungsten as an armour material. However, the joint of W and Cu …