This paper reports the successful implementation of copper wire ball bonding for selected
TO-220 devices on a high volume commercial scale. Since August 1992, copper wire …

Transfer molding is currently the most widely used process for encapsulating integrated
circuits. Although the process was introduced over 20 years ago, generating billions of parts …

This paper discusses the current reliability issues involved with typical postmolded IC
packages. Four major topics are presented, namely, stress, moisture permeation and …

In this paper, a fully three-dimensional (3-D) model is introduced for the simulation of wire
sweep during cavity filling in transfer molding of integrated circuit (IC) packages. This …

In this paper, the flow of encapsulant during the underfill encapsulation of flip-chips has
been studied theoretically and experimentally. Analytical as well as numerical methods have …

The viscosity of an epoxy-molding compound (EMC) has been characterized using a
parallel-plate viscometer and a specially-developed slit rheometer. In particular, steady-state …

Many kinds of gold wire and bond profiles have been used in wire bonding technology. To
date, no solid experimental results have been available to guide the bond designer in the …

In this study, the wire-sweep problem has been studied by performing experiments using a
commercial-grade epoxy molding compound, a real chip assembly, and an industrial …

Wire sweep has been recognized as one of the major defects in the encapsulation of
microelectronic chips by the transfer molding process. As thinner and denser IC packages …

Wire sweep is a main concern in the semiconductor packaging industry. The wire bonding
technology, providing versatile and reliable chip-connection method, is usually adopted for …