MS Smith - US Patent 9,432,298, 2016 - Google Patents
H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices; Multistep manufacturing processes thereof the devices being of types …
Monolithic 3D integration technology has emerged as an alternative candidate to conventional transistor scaling. Unlike conventional processes where multiple metal layers …
Energy consumed for transferring data across the processor memory hierarchy constitutes a large fraction of total system energy consumption, and this fraction has steadily increased …
Read mapping is a fundamental step in many genomics applications. It is used to identify potential matches and differences between fragments (called reads) of a sequenced …
Persistent memory is an emerging technology which allows in-memory persistent data objects to be updated at much higher throughput than when using disks as persistent …
The conventional approach of moving data to the CPU for computation has become a significant performance bottleneck for emerging scale-out data-intensive applications due to …
Ongoing climate change calls for fast and accurate weather and climate modeling. However, when solving large-scale weather prediction simulations, state-of-the-art CPU and GPU …
DU Lee, KW Kim, KW Kim, H Kim… - … Solid-State Circuits …, 2014 - ieeexplore.ieee.org
Increasing demand for higher-bandwidth DRAM drive TSV technology development. With the capacity of fine-pitch wide I/O [1], DRAM can be directly integrated on the interposer or …
GH Loh, MD Hill - Proceedings of the 44th Annual IEEE/ACM …, 2011 - dl.acm.org
Die-stacking technology enables multiple layers of DRAM to be integrated with multicore processors. A promising use of stacked DRAM is as a cache, since its capacity is insufficient …