Advanced three dimensional (3D) packaging is a key enabler in driving form factor
reduction, performance benefits, and package cost reduction, especially in the fast paced …

Electromigration (EM) causes intermetallic and void growth that decreases the reliability and
lifetime of solder joints. As a diffusion-controlled process, EM is highly dependent on the …

Intermetallic compound (IMC) and void growth are electromigration (EM) damage
mechanisms that are controlled by the anisotropic diffusion of Cu in β-tetragonal Sn solder …

Purpose Semiconductor packaging industry has in recent years tightened the tolerance
criteria for acceptable solder void size in the semiconductor packages due to the high usage …

It is significant to study power device package fatigue failure as it seriously affects the
reliability of power systems. Nevertheless, the research of the power device failure process …

Solder joint voids are usually formed by the entrapped gas bubbles during the reflow
process and are common in all surface mount applications. It is a controversial issue on the …

In recent years, power electronics packaging industry has tightened the tolerance criteria for
acceptable solder void size to below 5% in the power packages. Vacuum reflow technology …

The recent applications of 3D X-ray computed tomography (CT) in microelectronic
packages, including nondestructive failure analysis, defect monitoring in solder joints and …

Failure analysis (FA) could provide timely feedback to process optimization and solution
paths for system failures; thus, it is critical for the development of advanced driver assistance …

Solder joint interconnects in three-dimensional (3D) packages with package stacking
configurations typically must undergo multiple reflow cycles during the assembly process. In …