A comprehensive review on microwave FinFET modeling for progressing beyond the state of art

G Crupi, DMMP Schreurs, JP Raskin, A Caddemi - Solid-State Electronics, 2013 - Elsevier
FinFET is a multiple-gate silicon transistor structure that nowadays is attracting an extensive
attention to progress further into the nanometer era by going beyond the downscaling limit of …

Ground plane fin-shaped field effect transistor (GP-FinFET): A FinFET for low leakage power circuits

M Saremi, A Afzali-Kusha, S Mohammadi - Microelectronic Engineering, 2012 - Elsevier
In this paper, a fin-shaped field effect transistor (FinFET) structure which uses ground plane
concept is proposed and theoretically investigated. The ground plane reduces the coupling …

Assessment of electron mobility in ultrathin-body InGaAs-on-insulator MOSFETs using physics-based modeling

M Poljak, V Jovanovic, D Grgec… - IEEE transactions on …, 2012 - ieeexplore.ieee.org
We have investigated the electron mobility in ultrathin-body InGaAs-on-insulator devices
using physics-based modeling that self-consistently accounts for quantum confinement and …

Performance evaluation of linearity and intermodulation distortion of nanoscale GaN-SOI FinFET for RFIC design

A Kumar, N Gupta, SK Tripathi, MM Tripathi… - … -International Journal of …, 2020 - Elsevier
This work presents, performance evaluation of linearity and intermodulation distortion of
novel nanoscale Gallium Nitride (GaN) Silicon-on-Insulator (SOI) N-channel FinFET (n …

The impact of fin number on device performance and reliability for multi-fin tri-gate n-and p-type FinFET

WK Yeh, W Zhang, PY Chen… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
In this paper, the effect of carrier quantization on device characteristics and stress-induced
device degradation for multifin high-κ/metal tri-gate n-type and p-type fin field-effect …

Comparative study of novel u-shaped SOI FinFET against multiple-fin bulk/SOI FinFET

M Son, J Sung, HW Baac, C Shin - IEEE Access, 2023 - ieeexplore.ieee.org
Superior scalability and better gate-to-channel capacitive coupling can be achieved with
adopting gate-all-around (GAA) device architecture. However, compared against FinFET …

Spacer engineering for performance enhancement of junctionless accumulation‐mode bulk FinFETs

K Biswas, A Sarkar, CK Sarkar - IET Circuits, Devices & …, 2017 - Wiley Online Library
This study investigates the performance of the junctionless accumulation‐mode (JAM) bulk
FinFETs. Different electrical parameters are simulated and analysed for the device with …

Effects of fin width on device performance and reliability of double-gate n-type FinFETs

CL Lin, PH Hsiao, WK Yeh, HW Liu… - IEEE transactions on …, 2013 - ieeexplore.ieee.org
This paper investigates the impact of fin width (W fin s= 15, 20, and 25 nm) in a double-gate
n-type FinFET on the performance and reliability of the device. Carrier conduction in the Si …

Study on the regulation factors and mechanism of self-heating effects in non-rectangular 14 nm bulk FinFET

Z Qin, L Chen, R Lu, Y Wang, X Hao… - Semiconductor …, 2024 - iopscience.iop.org
This work investigates the innovative design of a 14 nm bulk 3D non-rectangular structure fin
field-effect transistor (FinFET). By incorporating a cylindrical trapezoidal structure into the …

The observation of width quantization impact on device performance and reliability for high-k/metal tri-gate FinFET

WK Yeh, W Zhang, YL Yang, AN Dai… - … on Device and …, 2016 - ieeexplore.ieee.org
In this paper, the impact of width quantization on device characteristic and stressing induced
device degradation for high-k/metal tri-gate n/p-type FinFET was investigated well including …