Ultrasound devices and methods are described, including a repeatable ultrasound
transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable …

To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be
employed in the receive signal path to reduce data bandwidth and a high-speed serial data …

To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be
employed in the receive signal path to reduce data bandwidth and an output data module …

Micromachined ultrasonic transducers integrated with complementary metal oxide
semiconductor (CMOS) substrates are described, as well as methods of fabricating such …

(*) Notice: Subject to any disclaimer, the term of this 6,756,681 B1* 6/2004
Hanawa........................ 257/774 patent is extended or adjusted under 35 6,784,547 B2 …

Complementary metal oxide semiconductor (CMOS) ultra sonic transducers (CUTs) and
methods for forming CUTs are described. The CUT's may include monolithically integrated …

CMOS Ultrasonic Transducers and processes for making such devices are described. The
processes may include forming cavities on a first wafer and bonding the first wafer to a …

A modular and tileable sensor array with routing in the interposer carrying the signals from
the sensors to the integrated circuits. In one embodiment a large area modular sensor array …

A CMUT or other semiconductor-based transducer is stacked with a piezoelectric transducer
(PZT). The CMUT is sufficiently thin to avoid or limit interference with sound propagation …

4,402,312 4.408, 599 4,573,453 4,762,121 4,996,511 5,007,411 5,014,681 5,031,604
5,052,377 5,108.455 5,113,887 5,172,689 5,175,214 5,179,941 5, 186,163 5, 193,549 …