Electrochemical migration of Sn and Sn solder alloys: a review
Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from
electrochemical migration (ECM) which significantly compromises the reliability of …
electrochemical migration (ECM) which significantly compromises the reliability of …
Recent advances in method of suppressing dendrite formation of tin-based solder alloys
B Liao, H Wang, W Xiao, Y Cai, X Guo - Journal of Materials Science …, 2020 - Springer
With the trend towards miniaturization and high density in electronics, electrochemical
migration (ECM) of tin-based solder alloys is becoming an increasingly serious issue …
migration (ECM) of tin-based solder alloys is becoming an increasingly serious issue …
Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry
This article reviews corrosion in electronic packaging mainly in the semiconductor industry
over the world. The previous study was reviewed scientifically to highlight the significant …
over the world. The previous study was reviewed scientifically to highlight the significant …
Investigation of corrosion on SAC 305, SAC 0307 and SAC 0307-0.03 P-0.005 Ni solder paste alloys in simulated body fluid (SBF)
The electrochemical migration (ECM) behaviour of SAC 305, SAC 0307 and SAC 0307-0.03
P-0.005 Ni has been investigated by using simulated body fluid (SBF) solution. Water drop …
P-0.005 Ni has been investigated by using simulated body fluid (SBF) solution. Water drop …
Electrochemical Migration Investigation on Lead-Free Sn-based Solder Alloys in 3.5 wt.% NaCl Solution
A Gharaibeh, D Rigler, B Medgyes… - … Spring Seminar on …, 2022 - ieeexplore.ieee.org
Electrochemical migration (ECM) behavior of three lead-free Sn-based solder alloys
(SAC305, Sn-3.7 Ag, and Sn-0.7 Cu) was investigated in 3.5 wt.% NaCl solution at 10 VDC …
(SAC305, Sn-3.7 Ag, and Sn-0.7 Cu) was investigated in 3.5 wt.% NaCl solution at 10 VDC …
Effect of ge doping on electrochemical migration of sac alloys in 0.5 m nacl solution
A Gharaibeh, B Medgyes - 2021 IEEE 27th International …, 2021 - ieeexplore.ieee.org
Electrochemical migration (ECM) behavior of three lead-free alloys: Sn3Ag0. 5Cu (SAC305)
as a reference, SAC305+ 0.1 Ge, and SAC0305+ 0.1 Ge was investigated in 0.5 M NaCl …
as a reference, SAC305+ 0.1 Ge, and SAC0305+ 0.1 Ge was investigated in 0.5 M NaCl …
The Fractal Characteristics of Electrodeposition and Electrochemical Migration Dendrites
AV Kosyrev, YV Ryzhikova, SB Ryzhikov - Moscow University Physics …, 2022 - Springer
The proposed model of stochastic dendrites in the process of self-organization has been
shown to be capable of modeling electrodeposition and electrochemical migration. The …
shown to be capable of modeling electrodeposition and electrochemical migration. The …
[HTML][HTML] Фрактальные характеристики дендритов электроосаждения и электрохимической миграции
АВ Косырев, ЮВ Рыжикова… - … университета. Серия 3 …, 2022 - cyberleninka.ru
Продемонстрирована возможность использования предложенной модели
стохастических дендритов в процессе самоорганизации для моделирования процессов …
стохастических дендритов в процессе самоорганизации для моделирования процессов …
ВЕСТНИК МОСКОВСКОГО УНИВЕРСИТЕТА. СЕРИЯ 3: ФИЗИКА. АСТРОНОМИЯ
АВ КОСЫРЕВ, ЮВ РЫЖИКОВА, СБ РЫЖИКОВ - ВЕСТНИК МОСКОВСКОГО … - elibrary.ru
Продемонстрирована возможность использования предложенной модели
стохастических дендритов в процессе самоорганизации для моделирования процессов …
стохастических дендритов в процессе самоорганизации для моделирования процессов …