Effect of equal-channel angular pressing on microstructural evolution, mechanical property and biodegradability of an ultrafine-grained zinc alloy

X Wang, Y Ma, B Meng, M Wan - Materials Science and Engineering: A, 2021 - Elsevier
Zinc alloys have become one of the most promising material groups for biodegradable
medical implants due to their desirable degradability, excellent biocompatibility, unique …

Investigation of annealing treatment on the interfacial and mechanical properties of Al5052/Cu multilayered composites subjected to ARB process

M Tayyebi, D Rahmatabadi, A Karimi, M Adhami… - Journal of Alloys and …, 2021 - Elsevier
This research aims to discuss the effect of annealing time and temperature on the interfacial
and mechanical properties in Al5052/Cu multilayer composites processed by accumulative …

Investigation of collision surfaces and weld interface in magnetic pulse welding of dissimilar Al/Cu sheets

M Sarvari, A Abdollah-zadeh… - Journal of Manufacturing …, 2019 - Elsevier
Abstract Magnetic Pulse Welding (MPW) is an essential procedure for joining of dissimilar
metals. The high velocity collision and jetting are the most important aspects of MPW …

Controlling of IMCs layers formation sequence, bond strength and electrical resistance in AlCu bimetal compound casting process

S Tavassoli, M Abbasi, R Tahavvori - Materials & Design, 2016 - Elsevier
This research aimed to produce Al/Cu bimetal through the compound casting process. The
control of the thickness and type of IMCs layers at Al/Cu interface were investigated by …

Atomic-scale deformation mechanisms of nano-polycrystalline Cu/Al layered composites: a molecular dynamics simulation

X Bian, A Wang, J Xie, P Liu, Z Mao, Y Chen… - Journal of Materials …, 2023 - Elsevier
In this paper, molecular dynamics (MD) simulation was employed to systematically study the
tensile deformation behaviors of nano-polycrystalline Cu, nano-polycrystalline Al, nano …

Solid-state bonding between Al and Cu by vacuum hot pressing

KS Lee, K Yong-Nam - Transactions of Nonferrous Metals Society of China, 2013 - Elsevier
Diffusion bonding between aluminum and copper was performed by vacuum hot pressing at
temperatures between 623 and 923 K through two thermal processes: hot compression …

Study of the intermetallic growth in copper-clad aluminum wires after thermal aging

A Gueydan, B Domengès, E Hug - Intermetallics, 2014 - Elsevier
Study of the solid-state diffusion between copper and aluminum was carried out in the
temperature range [573–673] K in order to better understand the aging mechanisms which …

[HTML][HTML] Effect of annealing process on interface microstructure and mechanical property of the Cu/Al corrugated clad sheet

J Han, S Li, X Gao, Z Huang, T Wang… - Journal of Materials …, 2023 - Elsevier
In this research, annealing treatment was performed on the Cu/Al corrugated clad sheets
fabricated by the corrugated cold roll bonding (CCRB) process. Interface microstructure …

Improvement of mechanical and electrical properties of rotary swaged Al-Cu clad composites

R Kocich, L Kunčická, A Macháčková, M Šofer - Materials & Design, 2017 - Elsevier
With the aim to investigate modifications in electric resistivity, mechanical properties and
structures of Al/Cu clad composites induced by various thermomechanical treatments, Al/Cu …

Fabrication and characterization of cold-swaged multilayered Al–Cu clad composites

R Kocich, A Macháčková, L Kunčická, F Fojtík - Materials & Design, 2015 - Elsevier
This study was focused on microstructure development and mechanical properties of three-
layered Al–Cu clad composites with different stacking sequences. The composites were …