Increasing data rates, spectrum efficiency, and energy efficiency have been driving major
advances in the design and hardware integration of RF communication networks. In order to …

Two-dimensional (2D) materials offer immense potential for scientific breakthroughs and
technological innovations. While early demonstrations of 2D material-based electronics …

Antenna-in-package (AiP) technology, in which there is an antenna (or antennas) with a
transceiver die (or dies) in a standard surface-mounted device, represents an important …

Silicon-based millimeter-wave (mm-wave) phased-array technologies are enabling
directional wireless data communications at Gb/s speeds. In this paper, we review and …

This article presents the design and demonstration of a high-bandwidth antenna-in-package
(AiP) module focusing on low-loss interconnects and Yagi-Uda antenna performance …

Driven by the increasing demand for high-throughput communication links and high-
resolution radar sensors, the development of future wireless systems pushes at ever greater …

A broadband and miniaturized planar Yagi antenna-in-package (AiP) design for the fifth-
generation (5G) wireless communication is proposed. The monopole taper radiator is …

Glass-based packaging presents unique opportunities for supporting 5G and beyond
frequencies. In this work, we present the first broadband characterization results for the …

Chip-embedded mm-wave antenna-integrated modules are demonstrated, for the first time,
on panel-scale ultra-thin glass substrates, for high-speed 5G communication standards in …

This article presents the design of a planar MIMO (Multiple Inputs Multiple Outputs) antenna
comprised of two sets orthogonally placed 1× 12 linear antenna arrays for 5G millimeter …